Ready-to-Use Solder Pastes for Jewellery Assembly and Repair
XBRAX® is a specialised range of ready-to-use solder pastes developed for the assembly and repair of gold, silver and platinum jewellery. Designed for both furnace applications and torch benchwork, XBRAX® ensures precise and reliable soldering performance across different manufacturing environments. Its semi-liquid consistency allows accurate positioning of the solder, enabling clean and controlled joining even in difficult-to-reach areas.
Engineered for Precision Jewellery Soldering
XBRAX® is developed to simplify and optimise jewellery soldering operations while improving process precision and consistency. Its formulation combines controlled melting behaviour, excellent wettability and accurate application, supporting cleaner and more reliable solder joints. The semi-liquid structure allows the solder paste to be positioned exactly where needed, reducing filler alloy usage and improving process control during assembly and repair operations. At the same time, the optimised metallurgical composition ensures excellent colour matching with the base alloy, minimising visible solder lines. Suitable for both manual and industrial applications, XBRAX® supports modern jewellery manufacturing with a more efficient and controlled soldering approach.
- Ready-to-use solder paste
- Excellent wettability and controlled metal flow
- Precise application in difficult-to-reach areas
- Reduced alloy consumption
- Excellent colour matching with jewellery alloys
Frequently Asked Questions
XBRAX® is supplied as a ready-to-use solder paste, allowing more precise application, improved process control and reduced material consumption compared to traditional wire or sheet soldering methods.
Yes, XBRAX® is suitable for both furnace applications and traditional bench soldering with a torch, ensuring flexibility across different jewellery manufacturing processes.
The semi-liquid consistency allows the solder paste to be accurately positioned on specific joining areas, improving precision and enabling soldering in surfaces that are otherwise difficult to reach.